As you all know, the Snapdragon 810 SoC was the subject of numerous reports and controversies, mainly because the chipset was apparently plagued by overheating issues. Not only benchmarks have reflected this, but the actions of other companies besides Qualcomm seem to have confirmed the chipset’s throttling problems, in their own way. Samsung refused to use it in the Galaxy S6 altogether; carriers in Japan have put up warning signs, and Sony – even though it employed the SD 810 on the Xperia Z5 Premium – tackled the problem by helping the chipset with a couple of heat pipes and thermal paste.
This leads us to today’s rumor, which claims that Samsung is now actively looking for heat pipe suppliers for the Samsung Galaxy S7. Does this mean the Snapdragon 820 overheats?
Hopefully not, but join us below for more details.
Samsung Looking For Heat Pipe Suppliers For The SGS7?
As some of you might recall, back in October, we came across a rumor suggesting that the Snapdragon 820 SoC faces overheating issues of its own. The same story claimed that Samsung might give Qualcomm a helping hand in finding a solution through a patch that should modify the microprocessor’s control program, but if this solution fails, sources also speculated that Samsung intends to add a heat pipe for better dissipation.
You may also recall that Qualcomm was very quick to deny these rumors, and only a couple of days after they emerged, the chipmaker claimed that that the Snapdragon 820 works well within standard parameters.
This brings us to today’s reports, claiming that Samsung is now actively looking for heat pipe suppliers for the upcoming Galaxy S7. The recent rumors have it that the company already received several test batches from various providers and that the concept is still in the earlier stages of design; thus Sammy is likely to experiment with different types and shapes of heat pipes.
Last but not least, sources say that Samsung has yet to make a final decision as to whether it should rely on a heat pipe or not, and add that the OEM will make up its mind on the matter by the end of the year.
Whatever the case may be, we’ll keep you posted if we find out more. Hopefully, the Snapdragon 820 works as intended. Otherwise, a second defective chip could indeed spell doom for Qualcomm.
This article has bee originally published here: http://www.gforgames.com/gadgets/samsung-galaxy-7-passive-cooling-needed-50813/
Related reading: Galaxy S7 design may not get major overhaul